Liquid and immersion is the new cool at Supercomputing ‘22
Source: The Register
Article note: They aren't kidding, easily over 1/3 of the show floor was cooling vendors, cooling parts (tubing, fittings, etc.) vendors, and OEMs showing off their cooling systems.
The quest for bigger denser clusters of commodity components has eaten the entire field. Money is not a limiting factor. Power in is not a limiting factor. Alternative designs are pushed to the fringes. It's all about extracting heat from machines that are only a hair different than gaming rigs, so they can be built denser for their networks.
With next-gen chips pushing 700W, thermal is the hot topic
SC22 It's safe to say liquid cooling was a hot topic at the Supercomputing conference in Dallas this week. …
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